Materials innovation drives next-gen AI chips, enabling performance, efficiency and scalability.

Traditional chips depend on flat, inflexible wafers; the Fudan team replaced these with elastic substrates capable of hosting resistors, capacitors, diodes, and transistors. Once patterned, each ...

Semicon USA highlights how chips are central to new tech like AI and faster internet. The way chips are put together, called advanced packaging, is changing chip design and making things more ...

Chinese researchers develop hair-thin fiber chips that can be woven into fabric, enabling smart textiles and implantable tech.

Chinese scientists have developed fully flexible fiber chips that embed complete electronic circuits inside ...

A recent report by a team of physicists at McGill University concluded that in order to build smaller yet still high-performing computer chips, designers will need to focus on better understanding how ...

It's been a long time since Alice Charton got a good look at a human face. There are plenty of people moving through her world, of course—her husband, her friends, her doctors, her neighbors—but ...

Fiber-based chip Photo: file. Constructing high-density integrated circuits within a fiber thinner than a human hair — a Chinese research team from Fudan University has pioneere ...

The key technical milestones achieved as part of Intel’s and AMD’s work on the x86 Ecosystem Advisory Group include new performance, security and reliability improvements coming to the x86 instruction ...

Engineers at the University of Delaware have uncovered a way to bridge magnetism and electricity through magnons—tiny waves that carry information without electrical current. These magnetic waves can ...