High-bandwidth memory (HBM) is again in the limelight. At GTC 2025, held in San Jose, California, from 17 to 21 March, SK hynix displayed its 12-high HBM3E devices for artificial intelligence (AI) ...

When people think about shiitake mushrooms, they imagine them as part of their ramen bowl or as complement for some other hot pot recipe. Few people—even the ...

PACSystems IPC 6010, IPC 7010 and IPC 8010 industrial computing platforms expand Emerson’s family industrial personal computer (IPC) models applications, including artificial intelligence (AI), ...

A new chip-connection system could help topple the "memory wall," which limits computing speed and the growth of AI models today, by transferring data along reconfigurable pathways of light rather ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...

Researchers have demonstrated that the layered multiferroic material nickel iodide (NiI2) may be the best candidate yet for devices such as magnetic computer memory that are extremely fast and compact ...

Google researchers have revealed that memory and interconnect are the primary bottlenecks for LLM inference, not compute power, as memory bandwidth lags 4.7x behind.

GIGABYTE, the world's leading computer brand, proudly announces the availability of its flagship X870E AORUS XTREME X3D AI ...

When shopping for a new CPU, you're likely to come across many different CPU specifications, such as cores, clock speed, TDP, and manufacturing process. Another important aspect of CPU hardware is ...

Dublin, Jan. 14, 2026 (GLOBE NEWSWIRE) -- The "Memory and Processors for Military and Aerospace Applications Market Report 2026" has been added to ResearchAndMarkets.com's offering. The memory and ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...